ME 5352
FUNDAMENTALS IN ELECTRONIC PACKAGING.
University of Texas at Arlington · UGRD · Fall 2026
1 section
Catalog description
An introductory treatment of electronic packaging, from single chip to multichip, including materials, electrical design, thermal design, mechanical design, package modeling and simulation, processing considerations, reliability, and testing.
Sections
Current meeting, instructor, credit, and enrollment details
001
Availability not recently verifiedClass #texas_arlington_new-4569Fall 2026UGRD3 credits
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