MAE 4305
FUNDAMENTALS OF ELECTRONIC PACKAGING.
University of Texas at Arlington · UGRD · Fall 2026
1 section
Catalog description
An introductory treatment of electronic packaging, from single chip to multichip, including materials, electrical design, thermal design, mechanical design, package modeling and simulation, processing considerations, reliability, and testing. Prerequisite: Must be in the professional ME or AE program and C or better in MAE 3314 or MAE 3309 ; or student group.
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001
Availability not recently verifiedClass #texas_arlington_new-4210Fall 2026UGRD3 credits
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