MAE 4306

COMPUTATIONAL TECHNIQUES FOR ELECTRONIC PACKAGING.

University of Texas at Arlington · UGRD · Fall 2026

1 section

Catalog description

Characterization of the thermo/mechanical reliability of microelectronics devices using commercial computational heat transfer codes (Icepack, Flotherm, and ANSYS). Industry related problems ranging from first level packages through system level packages analyzed. Formulate and model contemporary problems using commercial CFD codes. Prerequisite: Must be in the professional ME or AE program and C or better in MAE 3314 or MAE 3309 ; or student group.

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Class #texas_arlington-4211Fall 2026UGRD3 credits

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