Advanced Concepts in Semiconductor Packaging

Catalog description

The advanced course in semiconductor packaging will provide a thorough coverage of the materials, processes, failure, and reliability of chip level packaging. Specific topics include single-chip, multi-chip, wafer level and 3D stacked packaging, photonic integrated chip (PIC), smaller passives and embedded passive component technology, advanced substrates and microvia technology, solder technologies, metallurgy and joint formation, thermal management, thermal and mechanical behavior of packaging, failure analysis, and reliability testing. This course is cross-listed with RMET-656 ; students may receive credit for RMET-556 or RMET-656 , not both.