Electronics System Cooling

Catalog description

This is an introduction to thermal analysis and management of electronic equipment with focus on cooling of electronic devices. The emphasis of this course is on the application of fundamental heat transfer principles to predict thermal load, temperature distribution, and hot-spot in electronics. Topics include: Introduction to various modes of heat transfer; Fins and heat sinks- design, analysis, and optimization; thermoelectric and refrigeration cooling; nanofluids, liquid cooling, boiling heat transfer and phase change thermal storage system; heat pipes; Analysis and design studies for chip modules, printed circuit boards; and trends in thermal packaging. The course is aimed primarily to ME graduate students specializing in thermal and fluid science area. Typically offered Fall Spring Summer. Prerequisite(s): ME 41600 FOR LEVEL UG WITH MIN. GRADE OF C- Course Learning Outcomes 1. Understand thermal/fluid issues in electronics manufacturing and assembly. 2. Analyze conduction in printed circuit boards and chip packages. 3. Analyze convection cooling in electronics. 4. Understand solid-liquid thermal storage systems. 5. Design and optimization of heat sinks. 6. Perform thermal analysis on compact models of chip packages and heat sinks. View Class Schedule