Introduction to Heterogeneous Integration & Packaging of Electronic Systems

Catalog description

The semiconductor industry is expected to become a trillion-dollar industry by 2030. With new applications such as artificial intelligence, computing, storage, communications, and others emerging the demand for semiconductors will only increase. As the cost of monolithic integration (single chip) in advanced nodes is increasing there is a strong trend towards heterogeneous integration in the semiconductor industry enabled by advanced packaging. In this course you will learn how heterogeneous integration and packaging with chiplets is revolutionizing the semiconductor industry. This course introduces the history, challenges, and opportunities arising in the packaging of electronic systems. Electronic systems contain transistors interconnected together in the package and hence understanding heterogeneous integration and packaging cannot be complete without understanding the workings of the transistor and its interaction with the package. The course therefore covers the basics associated with integrated circuits, and packaging with a focus on high speed signaling, power delivery, thermal management, and packaging technologies in the context of computer and AI applications. As part of this course, the students will work on projects for the design of packaged sub-systems using physical CAD tools, parasitic extraction tools, and circuit simulators as shown below.