Chips-measurements

Catalog description

This hands-on course covers advanced topics in chip packaging, characterization, and measurements, including DC characterization, time domain measurements, frequency domain measurements, and small and large signal measurements as needed. This is a follow up course to ESE 5740/4740 where students designed and taped-out a chip. In this course, students will design PCBs and mount their packaged chip on the designed PCB and conduct characterization and measurements. The proposed chip systems will be demonstrated at the end of the course and the final report will be submitted.Students are welcome to use this course to design a chip towards their senior design project or master’s thesis (in coordination with their advisor).