Chips-design

Catalog description

This hands-on course covers advanced topics in semiconductor industry, design and tape-out of electronic chips, including the design process, layout process, and DRC and LVS procedures. Teams of students (each team consists of two students) design analog/digital/mixed mode circuits (either from the list of pre-defined systems or their proposed system), simulate the schematic, layout the circuit, extract the layout parasitics, perform full post-layout chip simulations, prepare the design for tape- out, and tape-out the chip. Chips are fabricated during the summer and packaged. Students will measure their chips in the follow up course, Chips-measurements, ESE 5750 /4750. Students are welcome to use this course to design a chip towards their senior design project or master’s thesis (in coordination with their advisor). Recommended prerequisite: ESE 3700 OR ESE 5700