ECE 6244

Design and Process Integration for Wide Band Gap

Ohio State University-Newark Campus · UGRD · Fall 2026

1 section

Catalog description

Power Devices Design and processing of wide band gap power devices (including SiC, GaN and ultra wide band gap semiconductors) and reliability considerations. 2D device simulations, layout considerations for power chip from 600 V to 15 kV. Prereq: Grad standing in Engineering or Physics. Not open to students with credit for 6234.

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Class #ohio_newark_campus-ECE6244Fall 2026UGRD3 credits

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