Power Electronics Design & Packaging

Catalog description

This course introduces design of high-performance power electronic circuits where the integrated physical topology must be considered as part of the circuit, and provides an understanding of the multitude of parasitic elements created by circuit layout, materials and fabrication techniques. A core tenant is learning integrated design with muliphysics simulators. This prepares the student for high-density, high-frequency design of converters/inverters/IVRs, pulse-power circuits (e.g. SSCBs and Double-Pulse Test circuits), gate drives and resonant topologies. The student is also introduced to AI/ML design and optimization of electro-physical circuits for low voltage (<=48V) and high voltage (>10kV) conversion applications and the commonalities in supplying power to the chip, for mobility, and to the grid. Students will have hands-on introduction to processes in the packaging lab(s).