MEMS 413BGA REWORK & X-RAY INSPECTION

Lorain County Community College · 2 credits · UGRD

Catalog

This course is about reworking and repairing circuit boards with ball grid array (BGA) chips as well as inspecting BGA chips with an x-ray inspection tool. Students will use a BGA rework station to rework ball grid array (BGA) chips, use an x-ray inspection microscope to inspect BGA chips before and after rework, as well as learn the principles of repair of ball grid array (BGA) by re-balling.Laboratory required. (A special fee will be assessed.)

Recent sections

Fall 2026 · 2 sections

Section	Days & time	Location	Instructor
P400Class #2853	Mon. 4:00 PM - 4:45 PM2026-08-24-2026-12-13	SM140	Vanderford
P600Class #2854