BGA REWORK & X-RAY INSPECTION

Catalog description

This course is about reworking and repairing circuit boards with ball grid array (BGA) chips as well as inspecting BGA chips with an x-ray inspection tool. Students will use a BGA rework station to rework ball grid array (BGA) chips, use an x-ray inspection microscope to inspect BGA chips before and after rework, as well as learn the principles of repair of ball grid array (BGA) by re-balling.Laboratory required. (A special fee will be assessed.)