MICRO-SYSTEM CAPSTONE PROJECT

Catalog description

This course is a capstone project built upon the previous Micro-electromechanical systems (MEMS) classes. The student will design, assemble, and test multiple printed circuit boards (PCB) with sensor(s) or environment interacting elements which will then be packaged and reproduced within the Micro-electromechanical systems (MEMS) cleanroom. Demonstrated circuits are to be fully functional meeting all specifications provided by the instructor at the beginning of class. The student will utilize skills and education learned in electronics (ELCT), computer aided drafting (CADD), and previous MEMS classes to design both electrical schematic and computer-aided artwork of PCB layout to specifications and then assemble PCBs by stencil printing, pick & place of Surface-Mount Technology (SMT) parts and solder reflow. A technical report with full operating procedure is also due at the end of class. Laboratory required. (A special fee will be assessed.)