MEMS PACKAGING

Catalog description

The course focuses on microelectronic integrated circuit (IC) and chip-on-board packaging. The student will be introduced to common packaging techniques and equipment used in the industry such as epoxy die attach, setup and operation of a thermosonic wire bonder, mechanical strength testing of wire bonds, chip encapsulation, chip-on-board processes, and microscope metrology. Laboratory required. (A special fee will be assessed.)