Advanced VLSI Design and Testing Issues

Catalog description

This course covers important concepts in Advance CMOS digital system including signal integrity issues and testing challenges. First part of the course focuses on interconnect planning and optimization, clock skew minimization and power integrity issues and various solutions to these problems. The course then focuses on advance testing issues facing testing industry and the commercial ATE. Fault modeling, collapsing, controllability and observability measures will be studied. We cover state of the art testability design including built-in self-testing, scan testing and ad hoc methodologies. The course also studies various industry adopted non-contact test methodologies such as electron beam probing, scanning force microscopy and IDDQ testing. Novel optical contactless testing methods such as all-silicon optical testing and IBM’s light emission testing (PICA) will also be covered.