EECT 154Microelectronics Packaging

Catalog

PREREQUISITES: PRE/COREQUISITES: COREQUISITES: DESCRIPTION: The course will introduce the materials, processes, and technologies used in back-end processes during semiconductor manufacturing. Students will learn how devices are packaged, interconnected, and protected for use in electronic systems. Topics will include packaging techniques used in the industry, such as die attach, wire bonding, flip-chip, surface mount assembly, encapsulation, inspection, and reliability testing. Laboratory activities will include hands-on assembly, inspection, and environmental testing of packaged devices and circuit boards.