MSE 6776
Microelec Sys Packaging
Georgia Institute of Technology-Main Campus · UGRD · Fall 2026
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Catalog description
Broad overview of system-level, cross-disciplinary microelectronics packaging technologies, including design, test, thermal, reliability, optoelectronics, and RF integration. Comparison of system-to-chip and system-to-package. Crosslisted with ECE and ME 6776.
Sections
Current meeting, instructor, credit, and enrollment details
A
OpenSeats: 10/10 seats Last recorded: Aug 9, 2026, 8:32 AMClass #92751Fall 2026UGRD3 credits
0 available10 enrolled10 capacity3/5 waitlist
- Days & times
- MW 1400-1515
- Meeting dates
- Aug 24 – Dec 17
- Location
- Manufacture Rel Discip Complex 2404
- Instructor
- Bakir, Muhannad
Details checked 4 hours agoSeats checked 4 hours ago
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