ECE 6776
Microelec Sys Packaging
Georgia Institute of Technology-Main Campus · UGRD · Fall 2026
1 section1 open now
Catalog description
Introduction to cross-disciplinary microelectronic packaging technologies, including electrical design, thermal considerations and technologies, reliability, optoelectronic packaging, and RF-/mm-packaging. Crosslisted with ME and MSE 6776.
Sections
Current meeting, instructor, credit, and enrollment details
A
36 openSeats: 34/70 seats Last recorded: Aug 9, 2026, 8:32 AMClass #90385Fall 2026UGRD3 credits
36 available34 enrolled70 capacity0/0 waitlist
- Days & times
- MW 1400-1515
- Meeting dates
- Aug 24 – Dec 17
- Location
- Manufacture Rel Discip Complex 2404
- Instructor
- Bakir, Muhannad
Details checked 5 hours agoSeats checked 5 hours ago
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