Thermal Management of Microdevices

Catalog description

This course addresses the thermal design in electronic assemblies which includes thermal characteristics, heat transfer mechanisms and thermal failure modes. Thermal design of electronic devices enables engineers to prevent heat-related failures, increase the life expectancy of the system, and reduce emitted noise and energy consumption. This course provides the required knowledge of heat transfer for such analysis and various options available for thermal management of electronics. This course also presents advanced methods of removing heat from electronic circuits, including heat pipes, liquid immersion, and forced convection. Undergraduate equivalent: MEEG 4323 .