Microelectronics

Catalog description

This course covers three methods of fabricating high-density interconnection structures for manufacturing microelectronic assemblies: thick films, thin films, and printed circuit boards. The thick and thin film technologies use substrates of metalized ceramic to make the interconnections between components and are capable of fabricating integrated resistors with high precision and stability. The printed circuit board technology uses organic materials with copper laminates to etch the interconnection patterns. The individual layers are laminated to produce the multilayer structure, but do not include integrated resistors. Each of the technologies is examined to determine the electrical and physical properties of the structures. Such parameters as distributed capacitance and how they affect circuit performance are discussed. In the laboratory accompanying the course, students have the opportunity to fabricate thick and thin film circuits and to examine the structure of printed circuit boards. Graduate equivalent: ECEG 5335 .