Product Design Lab

Catalog description

This laboratory course provides hands-on experience in measuring and analyzing the electrical and mechanical properties of materials used in the design of electronic products. It also covers thermal analysis and methods of removing the heat from electronic circuits. Experiential learning includes measurement of temperature coefficient of expansion, measurement of thermal resistance, measurement of tensile strength, measurement of material hardness, temperature measurement of electronic components, Peltier effect (thermoelectric coolers), heat pipes, convection cooling (fins and air flow), and heat flow across a bonding interface such as solder or epoxy.