Electronic Materials

Catalog description

This course describes the properties and applications of certain materials used in the design and manufacture of electronic assemblies. Ceramics are often used as insulators, heat sinks, and substrates for interconnection structures. The course presents electrical, mechanical, and thermal properties of various ceramics, along with methods of fabricating and machining ceramic structures. Adhesives used to mount components and to replace mechanical fasteners such as screws and rivets provide connections that are stronger and take up less space. The course examines properties of adhesives such as epoxies, silicones, and cyanoacrylates under conditions of high temperature storage and humidity, along with methods of applications. Solders used to interconnect electronic components and assemblies are selected for temperature compatibility, mechanical properties, and reliability. The course emphasizes the new lead-free solder materials and presents the properties of plastic materials and the methods of forming plastic structures.