Microelectronics

Catalog description

This course considers the methods of interconnecting electronic components at very high circuit densities and describes methods of designing and fabricating multilayer printed circuit boards, co-fired multilayer ceramic substrates, and multilayer thin film substrates in detail. It discusses the methods of depositing thick and thin film materials, along with their properties, and analyzes these structures and compares them for thermal management, high frequency capability, characteristic impedance, cross-coupling of signals, and cost. The course also includes techniques for mounting components to these boards, including wire bonding, flip chip, and tape automated bonding. Undergraduate equivalent: ELEG 4335 .