Characterization, Packaging and Testing of Nanofabrication Structures

Catalog description

This course examines a variety of techniques and measurements essential for controlling device fabrication and final packaging. Students will revisit concepts such as residual gas analysis introduced in TEL 261 , optical emission spectroscopy (OES) and end point detection as introduced in TEL 263. Characterization techniques such as surface profilometry, advanced optical microscopy, optical thin film measurements, ellipsometry, and resistivity/conductivity measurement will be implemented on nanofabricated samples. Basic electrical measurements on device structures for yield analysis and process control will also be stressed. These will include breakdown measurements, junction testing, and C-V and I-V tests and simple transistor characterization. In addition, students will examine mechanical as well as electrical characterizations of nanostructures for biological/biomedical applications. The students will perform DNA analysis by learning and performing the polymerase chain reaction for DNA replication. They will also study and manufacture microfluid channels for biological analysis. An extensive overview of biology will be given with emphasis on biocompatible materials. The students will also learn about the manufacturing issues involved in subjects such as interconnects, isolation, and final device assembly. The importance of planarization techniques such as deposition/etchback and chemical/mechanical polishing will be emphasized. Lastly, packaging procedures such as die separation, inspection bonding, sealing and final test for both conventional IC's and novel MEM and biomedical devices will be examined.