Electronics Cooling

Catalog description

Thermal management is an important aspect in the design and manufacturing of electronics devices and systems. Power dissipation levels have grown continually every year due to increased functionality and integration in the electronics devices and systems. Appropriate thermal design is imperative in order to prevent high temperature failures, increase the life expectancy of a system, reduce emitted acoustic noise and energy consumption, and meet stringent requirements for reliability. This course teaches students the fundamentals of heat transfer in electronics devices and systems and conduct effective thermal analyses using commercial CFD packages. The course is structured as a combinations of lectures, case studies, and tutorials. Heat transfer theory and discussions of engineering practices will be applied to the thermal design and analysis of electronic systems. Numerical simulation and commercial CFD package will be introduced for thermal fluid analysis and design of electronics systems and “real world” case studies will be used for class discussions and student presentations. The topics including thermal management at the component, board, and system levels, heat sink design, heat pipes, phase-change cooling, and data center cooling.