Processes for Electr Mfg.

Catalog description

The purpose is for the students to gain a broad knowledge and understanding of the basics of printed circuit board manufacturing and assembly. The course offers an introduction to surface mount and insertion mount components, materials and processes as well as to PCB design and manufacturing. Lectures will introduce assembly process flows and component types, PCB construction and defects solder paste printing and equipment, placement processes and equipment, reflow and ovens, flip chip assembly and underfilling, defects and mitigation, reliability optimization and testing. Efforts will be made to include visits to local industrial assembly facilities as well as equipment on campus. The overall goal is to provide the students with a basis for communicating and working with subject matter experts. This course is considered a technical elective for undergraduate students. Prerequisite: Senior standing or permission of instructor. Crosslisted with SSIE 578. Offered in the fall semester.