Electronics Packaging for Computing and Energy Applications

Catalog description

Electronics packaging technologies are growing rapidly throughout the world to satisfy the demands for application systems such as consumer electronics, transport, aerospace, datacenters, IoT, AI, industry and energy conservation as evidenced by the recent Chips Acts in the U.S. and around the world, where governments and industry are investing heavily in electronics packaging technologies, research and innovation. There is an urgent need for innovation in electronics packaging and a skilled workforce to fulfill industries' future vision of going beyond Moore's Law. This course better prepares students for the electronics industry by teaching them the fundamental principles of electronics packaging. Students learn the key areas of package types, electrical design, thermal design, materials selection, reliability assessment and the challenges and trade-offs required for electronics packaging for different application systems.